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Sign in to Purchase Instantly. Overview Since overall circuit performance has depended primarily on transistor properties, previous efforts to enhance circuit and system speed were focused on transistors as well. Product Details Table of Contents. Table of Contents 1 Introduction 1 1.

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Dual Damascene Copper Interconnect Fabrication

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Monthly overview View Product. After defining the framework of this study, describing the archaeological evidence for metallurgy dating from After defining the framework of this study, describing the archaeological evidence for metallurgy dating from the emergence of the first copper finds c. Copper Electrodeposition for Nanofabrication of Electronics Devices.

Samenvatting Since overall circuit performance has depended primarily on transistor properties, previous efforts to enhance circuit and system speed were focused on transistors as well. During the last decade, however, the parasitic resistance, capacitance, and inductance associated with interconnections began to influence circuit performance and will be the primary factors in the evolution of nanoscale ULSI technology.

Because metallic conductivity and resistance to electromigration of bulk copper Cu are better than aluminum, use of copper and low-k materials is now prevalent in the international microelectronics industry. As the feature size of the Cu-lines forming interconnects is scaled, resistivity of the lines increases.

At the same time electromigration and stress-induced voids due to increased current density become significant reliability issues. In this book, a leader in the field describes advanced laser systems with lower radiation wavelengths, photolithography materials, and mathematical modeling approaches to address the challenges of Cu-interconnect technology. Toon meer Toon minder. Recensie s From the reviews: This book addresses the major issues encountered with the use of copper for interconnection lines in microelectronics.

It combines materials, technology, and applications to address the needs of the microelectronics researcher. This book is filled with graphs, data, properties, applications, and methods that will provide both the graduate student in microelectronics and the working microelectronics professional with current information on copper interconnection technology. Applied Materials AMAT reckons it has pushed the boundaries of interconnect technology, the pathways that connect the billions of transistors on a chip.

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Featuring revolutionary copper reflow technology, the Amber system is claimed to be the only single-chamber solution proven to enable void-free copper structures at the 1Xnm node - a critical challenge in the manufacturing of advanced logic and memory devices. This technology enables the deposition of the vital wiring seed layer and AMAT says it has no foreseeable node limit. Over thirty chambers have already been shipped to leading chipmakers. We're seeing strong customer momentum for the Amber system with more than 30 chambers already in the field.

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Systems are already qualified as tool of record at leading logic and memory device manufacturers," he continued. Today's high-density microchips feature complex, multilevel networks with more than 60 miles of copper wiring and as many as 10 billion vertical connections, or vias, between layers.

Moving forward, these numbers will significantly increase, with interconnect structures becoming much narrower and deeper, making it extremely difficult for conventional technologies to completely and reliably fill the structure with copper. At the 1Xnm node, this is a major concern, since a single void can render the chip useless. Applied's Amber copper reflow technology solves this critical challenge by turning the small size of these features from a problem to an advantage.

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Using capillary action, the deposited copper is drawn into even the smallest features, filling from the bottom upwards to enable rapid, void-free fill from the smallest to the largest features on any die layout. The CuBS RFX system's unique selective PVD technology provides the precise deposition profile - thicker at the bottom and no copper overhang - that is essential for the subsequent reflow process. You may also request additional information if required, before submitting your application. Please complete all fields below. These will only be used to evaluate your application, and to ensure your requested subscription reaches you.

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